Semiconductor materials are at the core of modern electronics, microelectronics, optoelectronics, power devices, sensors, and advanced energy technologies. As semiconductor devices become smaller, faster, and more highly integrated, the quality and consistency of semiconductor materials have become increasingly critical to device performance, manufacturing yield, reliability, and long-term stability.
Semiconductor Materials Testing provides a systematic approach to evaluating the physical, chemical, structural, electrical, thermal, and surface properties of semiconductor materials. From silicon wafers and compound semiconductors to thin films, epitaxial layers, dielectric materials, and advanced semiconductor materials, comprehensive characterization helps researchers and manufacturers understand material behavior and identify potential defects or process-related variations.
Our testing items include, but are not limited to:
Semiconductor Materials Testing
Resistivity testing
Extension resistance testing
Minority carrier lifetime testing
Minority carrier diffusion length testing
Hall effect testing
Infrared spectrum testing
Energy level transient spectrum testing
Positron annihilation spectroscopy testing
Photofluorescence spectrum testing
Ultraviolet-visible absorption spectrum testing
Electron beam induced current testing
I-V and C-V testing
Performance evaluation and methods of semiconductor materials
Structural integrity of crystals: Crystal orientation, lattice defects (dislocation density)
Crystal orientation: Optical crystal orientation method, X-ray crystal orientation method.
Defects: Crystal orientation observation, scanning electron microscope (SEM), transmission electron microscope (TEM), atomic force microscope (AFM), X-ray topography.
Composition analysis: Chemical composition of materials, density and distribution of doped atoms, oxygen and carbon content, heavy metal impurities, etc.
Doping concentration analysis: Hall measurement, C-V measurement, secondary ion mass spectrometer.
Oxygen and carbon content: Infrared absorption spectroscopy.
Analysis of trace impurities such as heavy metals: Auger electron spectroscopy (AES), X-ray emission spectroscopy (XES), X-ray emission spectroscopy (XPS), neutron activation analysis (NAA), mass spectrometry, atomic absorption spectroscopy.
Optical properties: Refractive index, absorption coefficient, photoconductivity, luminescence characteristics of thin film materials, etc.
Reliability testing: IC testing, reliability lifetime and burn-in screening, destructive physical analysis, etc.
IC Testing: Circuit design verification and test program development, final device testing, failure analysis, and combined temperature–vibration–humidity (TVH) tri-stress testing.
Reliability lifetime and burn-in screening: Burn-in screening tests, accelerated life tests, reliability enhancement tests.
Destructive physical analysis (DPA): Internal wire bond pull strength, X-ray inspection/XRF, die shear strength.
Morphology analysis: Non-metallic inclusion rating, macro-metallographic structure analysis, average grain size evaluation, micro-metallographic analysis, carburized/nitrided/hardened case depth measurement, etc.
Morphology analysis techniques: 3D digital microscope, SEM, TEM, AFM, FIB, 3D surface profilometry.
Thermal properties: Melting point, melt flow index (MFI), abnormal ball indentation temperature, degree of cure, thermal resistance, thermal conductivity, thermal decomposition temperature, low-temperature brittleness, etc.
Thermal property testing techniques: Thermogravimetric analyzer (TGA), thermal resistance tester, thermo-mechanical analysis (TMA), ball indentation tester, differential scanning calorimeter (DSC), laser flash thermal conductivity analyzer, dynamic mechanical analyzer (DMA), Hot-Disk thermal constants analyzer.
Flammability / safety performance: Flash point, glow-wire test, flame retardancy tests, hot-wire ignition, needle-flame test, horizontal/vertical burning tests, etc.
Flammability / safety testing techniques: Hot-wire ignition tester, horizontal/vertical burning tester, glow-wire tester, needle-flame tester.
Microstructural analysis: Grain size, porosity, metallographic structure, micro/nano dimensions, internal defect inspection, fusion/penetration depth, etc.
Microstructural analysis techniques: BET porosity analyzer, X-ray transmission system, 3D digital microscope, optical emission microscope, SEM/EDS, TEM, FIB, scanning acoustic microscope (SAM).
Mechanical property testing: Tensile test, adhesion test, torsion test, impact test, creep test, friction and wear test, hardness test (Brinell, Rockwell, Shore, pencil hardness, micro-Vickers, etc.), etc.
Mechanical testing instruments: Hardness testers, tensile/shear testers, residual stress analyzers, fatigue testing systems, wear testing systems, Charpy impact testing systems, mechanical shock test platforms, high-temperature creep/rupture test machines, microcomputer-controlled universal testing machines.
Electrical property testing: Dielectric strength, comparative tracking index (CTI), dielectric constant, dissipation factor, surface resistivity, electrical conductivity/resistivity, volume resistivity, insulation resistance under humidity (SIR test), etc.
Electrical testing instruments: High-resistance meters, micro-ohmmeters, curve tracers, network analyzers, withstand-voltage testers, leakage current testers, multi-channel data acquisition systems, multi-frequency LCR meters
Nondestructive testing (NDT): Ultrasonic testing (UT), eddy current testing (ECT), magnetic particle testing (MT), penetrant testing (PT), radiographic testing (RT), industrial CT, etc.